Each step in the PCB manufacturing process adheres to strict inspection standards.
01File Review
Before production begins, we perform a comprehensive review of the design files provided by the customer (e.g., Gerber files) to ensure the integrity and manufacturability (DFM) of the PCB design. We also generate the necessary drill files, artwork files, and other production tools to ensure the accuracy and efficiency of subsequent processes.
02Inner Layer Fabrication
For multi-layer PCB production, inner layer fabrication is a crucial step. We use advanced photo imaging technology to precisely transfer the circuit pattern onto the copper-clad laminate, and chemically etch away excess copper to form the circuit pattern. AOI (Automated Optical Inspection) is then used to inspect 100% of the inner layer, ensuring no open circuits, shorts, or other defects.
03Drilling
We use high-precision CNC drilling machines to process through-holes, blind vias, and buried vias, ensuring precise hole locations and dimensions that meet design requirements. The cleaning process after drilling further removes residue inside the holes, laying a solid foundation for the subsequent via plating process.
04Through-Hole Plating
Through-hole plating is a core process for achieving interlayer electrical connections. We first use chemical copper deposition to deposit a conductive copper layer inside the holes, followed by electroplating to thicken the copper layer, ensuring the reliability of electrical performance and mechanical strength. We strictly control the plating thickness to meet international standards.
05Outer Layer Fabrication
The outer layer fabrication determines the final circuit pattern of the finished PCB. We use high-precision exposure technology and electroplating to transfer the circuit pattern onto the outer layers, followed by etching to remove excess copper foil. Once complete, all outer layers undergo AOI inspection again to ensure every PCB meets the design requirements.
06Solder Mask Application
Applying a solder mask to the PCB surface effectively protects the circuit areas and prevents soldering short circuits. We use automated coating equipment and precise exposure technology to ensure the solder mask ink is evenly applied, with precise opening for the soldering areas. After high-temperature curing, the solder mask layer provides excellent wear resistance and insulation properties.
07Surface Finish
To enhance the solderability of the PCB and protect exposed surfaces, we offer a variety of surface finish processes, including Hot Air Solder Leveling (HASL), Electroless Nickel Immersion Gold (ENIG), Immersion Tin, and OSP (Organic Solderability Preservative). Each process meets international standards to fulfill different application requirements.
08Electrical Testing
Before shipment, each PCB undergoes a comprehensive electrical test, including continuity and insulation checks. We use advanced flying probe or bed-of-nails test equipment to ensure that all electrical connections meet the design requirements, providing customers with stable and reliable products.
09Final Inspection
Once production is complete, we conduct a final inspection of the PCB's appearance and functionality to ensure there are no defects.
10Packaging
The PCBs are then packaged using anti-static bags, foam, and other materials to protect them from electrostatic discharge and physical damage. Finally, the PCBs are sealed in protective bags, labeled, and packed in outer cartons with cushioning materials to ensure safety and stability during transportation.
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