PCB Prototype-SMT chip processing factory [Pcbasic electronics]

Break-away Rail:

PCB Thickness:

0.6 0.8 1.0 1.2 1.6 2.0 2.5 3.2
≥1.7-6.0 * Unit: mm

PCB Solder Mask:

Green Red Yellow Blue White None Black
Matte black

Silkscreen:

White Black

Electrical Test

Sample Test Free

Finished Copper:

1 oz Cu 2 oz Cu

Thickness:

0.203 0.305 0.406 0.508 0.813 1.524 * Unit: mm

Thickness:

0.101 0.168 0.254 0.338 0.422 0.508 0.762 1.524 * Unit: mm

Min.Track/
Space Outer:

10/10mil ↑ 8/8mil ↑ 6/6mil 5/5mil 4/4mil 3.5/3.5mil

Min.Drilled Hole:

0.3mm ↑ 0.25mm 0.2mm 0.115mm

Via Process :

Tenting vias Vias not covered Solder Mask Plug(IV-B) Non-Conductive Fill & Cap(VII)

*For Gerber files this choice will not affect anything, PCB will be made using the parameters of the files.

Surface Finish:

HASL with lead HASL lead free ENIG OSP

Special Process:

HDI(Buried/blind vias) Impedance Beveling of G/F Plated Half-holes/Castellated Holes

X-out:

Accepts Not accepting

Report Format:

Paper Electronic

UL Mark:

UL+Week/Year UL+Year/Week

Thickness of
Immersion Gold:

1U" 2U" 3U"

Au/Ni thickness:

Au:10U"/Ni:120U"

Please choose other options of Gold /Nickel thickness here

Thickness of
ENEPIG:

Ni:200U" Pd:2U" Au:2U"

Please choose other options of Au/Pd thickness here

Thickness of
ENEPIG:

Ni:200U" Pd:2U" Au:2U"

Please choose other options of Au/Pd thickness here

Au/Ni thickness:

Au:5U"/Ni:120U"

Please choose other options of Gold /Nickel thickness here

Thickness of
Immersion Gold:

1U" 2U" 3U"

Inner Copper:

1 oz 1.5 oz 2 oz 3 oz 4 oz 5 oz 6 oz

Special Requests:

+ Add PO No.

PCB PROTOTYPE
OR PCB FABRICATION IS FREE!

PCB Specification Selection How it works (3 steps)

PCB file (optional):

Material:

Layer Count:

TG:

Board type :

Different Design
in Panel :

Different Design in Panel:

* Size (single):

* Quantity (single):

*Your Email:

Your Tel:

Show Optional Items:

* Panel Type

Copper layer:

Break-away Rail:

PCB Thickness:

PCB Solder Mask:

Silkscreen:

Electrical Test

Finished Copper:

Thickness:

Thickness:

Min.Track/
Space Outer:

Min.Drilled Hole:

Via Process :

Surface Finish:

Special Process:

X-out:

Report Format:

UL Mark:

Thickness of
Immersion Gold:

Au/Ni thickness:

Thickness of
ENEPIG:

Thickness of
ENEPIG:

Au/Ni thickness:

Thickness of
Immersion Gold:

Inner Copper:

Special Requests:

PCB PROTOTYPE OR PCB FABRICATION IS FREE!

PCB Specification Selection How it works (3 steps)

PCB file (optional):

Material:

Layer Count:

TG:

Board type :

Different Design in Panel :

Different Design in Panel:

* Size (single):

* Quantity (single):

*Your Email:

Your Tel:

Show Optional Items:

* Panel Type

Copper layer:

Break-away Rail:

PCB Thickness:

PCB Solder Mask:

Silkscreen:

Electrical Test

Finished Copper:

Thickness:

Thickness:

Min.Track/Space Outer:

Min.Drilled Hole:

Via Process :

Surface Finish:

Special Process:

X-out:

Report Format:

UL Mark:

Thickness of Immersion Gold:

Au/Ni thickness:

Thickness of ENEPIG:

Thickness of ENEPIG:

Au/Ni thickness:

Thickness of Immersion Gold:

Inner Copper:

Special Requests:

PCB PROTOTYPE
OR PCB FABRICATION IS FREE!

Different Design
in Panel :

Min.Track/
Space Outer:

Thickness of
Immersion Gold:

Thickness of
ENEPIG:

Thickness of
ENEPIG:

Thickness of
Immersion Gold: