There are different types of packaging used for electronic components, and these packages have a high effect on the working and manufacturing of PCB boards. BGA and LGA are commonly used two main types of packages for PCB boards. Both come with their features and limitations, and each affects the working of the PCB board. 

LGA  or Land Grid Array package is a packaging type that is used to configure integrated circuits and microprocessors on different PCB boards. The BGA packages are part of graphics processors, high-density ICs, and microprocessors. Here we will discuss their features, advantages, disadvantages, applications, and differences. So let's get started.

1. What is LGA?

The LGA stands for Land Grid Array packages and comes with a pinout for connection. So it is used for applications where the board design comes with a socket connector. For boards that do not have a socket, using LGS is the best option. This package comes with rectangle-shaped grids on the lower side made of solder paste but does not use all grid rows and columns. These grid components can come in circular or triangular designs. Some come with a honeycomb look.

Definition

●      The LGA is surface mounting packaging used for ICs and comes with a certain number of pins for connections. It comes with pads on the lower side for making connections to the pads on board.

Advantages and disadvantages of LGA

BGA Advantages

●      LGA packages come with a larger pin count as compared to BGA packages. So, these are the best options for use in complicated circuits that need to connect more components.

●      It provides easy testing and inspection features since its contacts can easily be seen with the naked eye.

●      The mechanical strength and support of LGA package pins are higher than those of BGA. So they can easily handle high pressure and stress.

●      LGA is lower cost than BGA packages.

●      This package is the best option for use in small spaces with high-power device circuits.

●      It offered durability features.

●      Its pins are small and can easily be configured in small spaces.

●      It has low parasitic inductance and capacitance, so it is best to use for high-frequency applications.

●      Hot air system used for reworking

●      This packaging comes with a low impedance value since it has short interconnection paths. That helps to provide high-speed signal transmission.

BGA Disadvantages

●      The pins of LGA take up more space, which can reduce connection density and also packaging size.

●      The solder joints of LGA and PCB boards get exhausted with time due to vibration and stress applications and provide reliability problems.

●      Its pins are configured on the inner side and have difficulty repairing if they get damaged and need specialized tools to repair.

●      It is not used for automated optical inspection (AOI).

1.2 Applications of LGA Components

●      Different Intel Core i7 processors use LGA packages like the 1151 socket type.

●      LGA packages are also part of DDR4 memory, like the LGA 3647 socket.

●      The desktop gaming PC comes with Intel LGA packages.

●      A different controller, such as the Intel I210 Ethernet controller, also has LGA packaging.

●      It is also part of MOSFET, for example, Infineon OptiMOS.

2. What is BGA?

BGA packaging comes with a solder ball array at the lower side. These solder balls make the connection of the packaging with the circuit board. The working of BGA for PCB board is possible for such a configuration where copper pads support the solder balls. The solder balls on the packaging can be configured electrically or annually.

This packaging provides good heat dissipation due to the good thermal conductivity features of solder balls. It offers good signal quality due to short electrical paths that reduce the inductance and capacitance.

Some common types of BGA are:

●      Plastic ball grid array: It is made with plastic-coated casing and has a substrate of glass with ball pitch dimensions of 1.0 mm and 1.27 mm.

●      Ceramic ball grid array: It has a ceramic substrate configured on FlipChip (FC) electrical connections.

●      Tape ball grid array: It comes with a soft strip substrate having one to two layers of board, and it is also called Flex Tape BGA.

Definition

Ball Grid Array is a certain type of surface mount packaging that has solder balls. It comes in plastic and ceramic configurations. Its main features are high leads, compact size, and low inductance features.

2.1 Advantages and disadvantages of BGA

Advantages

●      BGA is compatible with larger pin density than LGA packaging, so it is best for a larger number of connections.

●      Its thermal capability is better than that of LGA since solder balls have good heat-transferring features for components and the PCB.

●      Its small size allows it to be used for compact structures and high-density components connected to PCBs.

●      It provides a small form factor with high input/output density. It is used for complicated ICs.

Disadvantages

●      The solder balls are connected on the inner side, which stops the visual inspection for finding faults. There is a need for X-rays to view the components connected to this packaging for repair.

●      This packaging uses some more steps that make it high-cost for component connection with solder balls.

●      It also has reliability issues for the connection of the PCB board with BGA packaging and causes mechanical and thermal stresses.

●      BGA is not supported for all components since it only supports multilayer boards.

●      There is a need for a special type of solder packaging on board.

2.2 Applications of BGA Components

●      BGA packaging is part of different GPUs, like the Nvidia GeForce RTX 3090.

●      Qualcomm Snapdragon 888 is a type of system-on-chip processor that uses BGA packages.

●      Xilinx Virtex UltraScale+ is a field-programmable gate array that also uses BGA, and memory controllers like Cypress HyperBus Memory Controller use BGA.

●      Automobile electronics need such a type of packaging that has features to handle different working conditions, such as high temperatures, mechanical stress, and vibrations. So LGA packages have features to handle these parameters.

●      The BGA is also used for the creation of consumer electronic devices since they need compact size and slim structure that can be provided by BGA packages. As BGA has a high pin count and helps to connect many components in limited space

3. LGA vs. BGA comparison

4. Considerations for choosing the right package

Before using BGA and LGA packaging for your project, follow these points.

Pin count

●      If your project needs a larger pin connection, then use BGA packaging, and for low pin configuration, use LGA packaging.

Thermal performance:

●      If you are working on projects where connected components produce larger heat and for high-performance applications, BGA is the best option to use since it dissipates heat effectively.

Signal integrity:

●      BGA offers good signal quality since it has low capacitance and inductance due to short interconnection paths. For circuits that are sensitive to signal quality, use BGA packaging.

Mechanical stability:

●      For applications where different factors like vibration, shock, or stress are involved, use LGA packaging since it provides good mechanical stability.

Cost:

●      For cost-effective projects, use LGA packaging since it has a lower cost than BGA.

Size:

●      For projects that have space limitations and need small-size component connections, then use BGA packaging that comes with a compact size.

Repairing:

●      The repair of LGA is easy, and they are also replaced easily. Since they have easy-to-visual and access pins, for components where the repairing process is needed easily, then use the LGA packages of choice.

BGA and LGA packaging are important for electronic components. Both are commonly used for components based on their features and other parameters. LGA is used since it has good mechanical stability features and low-cost assembly. The use of BGA is based on its good thermal features and provides quality signal transmission. BGA is part of the circuit where a high pin count is needed. Whether you are using LGA or BGA, you must check the project requirements, such as pin requirements, signal flow, cost, design size, etc.