With the advancement of technology, different processes are involved in PCB manufacturing. SMD, or surface mounting devices, has given new life to the electronic field. With the use of this technology, we can make compact, low-weight devices and also get other features. Small components are used to create PCB boards configured directly on board in this process.

SMD devices and components are not becoming the main part of electronic circuits and projects. They come with different types of SMD packages that help to make projects on different parameters and features. Different packages help to optimize the circuit's thermal features, electrical performance, and accurate use of space on board. Here, we will learn about various SMD package types and their features. So let's get started!

SMD components and SMD package 

1.1 SMD components

SMD components

SMDs are electronic components that are directly connected to the PCB board. Their small size and high component density help to make effective circuit designs. The use of SMD components allows devices to operate in an optimized way, and now different SMD component sizes are available that allow them to be used for cell phones, computers, and other devices. Their use in circuits helps to control current flow in circuits, which also affects the working of devices. Some commonly used SMD components are.

·   Resistors

·   Capacitors

·   Inductors

·   Diodes

·   Transistors

·   Integrated Circuits

1.2 SMD package

SMD resistor packages

SMD resistor packages are rectangular with a numerical value showing their measurements for the required connection space.

SMD Packages Dimensions (Inch)

SMD Transistors Packages

This type of SMD package comes with further 3 types, and each has its uses and dimensions.

SOT-23

·  Uses: small signal transistor

·   Dimensions: 2.9 mm by 2.4 mm by 1.1 mm.

SOT-23

·   Uses: general purpose and small signal transistor

·   Dimensions: 2.9 mm by 2.4 mm by 1.1 mm.

SOT-323

·   Uses: compact and small spaces

·   Its dimension values are 2.1 mm by 2.1 mm by 0.9 mm.

SOT-523

·   Uses: It is used where small-size connections are required.

·   Dimensions: 1.6mm by 1.6mm by 0.7mm

SMD Integrated Circuits or IC packages

5 types of packages used for SMD ICs

·   Small outline integrated circuit

·   Small outline package

·   Ball grid array

·   Quad flat pack

·   Plastic leaded chip carrier

1.3 Relationship between SMD components and SMD package

·   The different physical and electrical features of devices are explained by SMD packages that use SMT technology to connect components directly with the use of soldering on the PCB board.

·   SMDs are components such as transistors, resistors, ICs, etc., connected to the PCB board using the SMT process.

SMD component package types

2.1 Chip Resistors and Capacitors

Chip Resistor

0805:

·   Its dimension values are 2.0mm x 1.25mm. It can easily be used with larger sizes.

0603:

·   0603 measurements are 1.6mm x 0.8mm and commonly used for different circuits.

0402:

·   Its dimensions are 1.0mm by 0.5mm and used for mobile circuits and some other high-density circuits.

0201:

·   It is a small-size resistor that comes with dimensions of 0.6mm x 0.3mm and is part of high-density circuits.

2.2 Integrated Circuits (ICs)

Integrated Circuit

The manufacturing process's last phase of semiconductor modules is IC packages, where a die is covered, saving the inner circuit from corrosion and other environmental factors. Commonly used IC packages are TSOP, QFP, SOIC, TQFP, MSOP, QSOP, and BGA.

2.2.1 Soic vs. Sop

SOIC packaging comes with a pin distance of 1.27 mm, and pins are bent, which reduces sizes.

While SOP is like SOIC, it is called mini SOIC packages.1.27 mm is an acceptable pitch value and provides a low form factor.

2.2.2 QFP (Quad Flat Package) vs. QFN (Quad Flat No-Lead):

QFP packages come with leads or pins configured at the lower part of packages and used for connecting PCBs to packages. It has a pin range from 32 to 280 or higher.

QFN packages are without leads or pins and use SMT technology to make connections to the PCB board. This package type has fewer pins than QFp—about more than 8

2.2.3 BGA (Ball Grid Array):

A ball grid array is an SMT packaging type that is part of ICs. BGA packages for different devices that are permanently mounted, such as controllers or processors. Compared to dual-inline or flat packages, BGA has more connection pins that help to connect more devices.

There is a need for accuracy for the BGA device's soldering process and for soldering automated methods used, such as computer-controlled automatic processes.

2.3 Transistors and Diodes

Transistors and Diodes

A diode is a semiconductor with 2 pins for AC to DC conversion. The process involved is called a rectifier.

A transistor is a 3-pin semiconductor that is used for switch and amplifier circuits. Its pins are an emitter, base, and collector. Transistors are of two common types: BJT and FET. Further types of BJT transistors are NPN and PNP based on doping materials. Transistors are now the main component of amplifier circuits.

2.4 Inductors

Inductor

The basic work of the inductor is to store energy in the form of a magnetic field as a result of current flow through it, also called a passive component. Its other name is choke, coil. It has two pins, and its working is based on the inductance value.

2.5 Connectors

Connectors

Electronics connectors are components used in electronics to connect different devices. Housing and terminals are the main parts of connectors. It also comes with a plug and a female jack component. Common types of connectors are.

·   board-to-board connectors

·   cable/wire-to-cable

·   cable-to-board connectors

Now, the work of different electronics projects and their design is based on SMT package types and sizes. Each SMD package comes with its features, sizes, and dimensions. These package types make different circuit combinations, either simple or complicated. The use of SMD and SMT technology makes our electronic and PCB board creation process easy and low-cost, as well as taking less time. Some commonly used SMD packages are QFP, BGA, and SOT; each has its features that help to make the board properly heat-managed and enhance its working.